System and method for improved epitaxial lift off

ABSTRACT

An apparatus, system and method for performing ELO are disclosed. Device assemblies are contemporaneously etched in a stacked arrangement. Each device assembly may be placed in a respective tray, where the trays are overlapped and spaced apart from one another. In this manner, more device assemblies can be etched per unit area compared to conventional systems. Further, by stacking device assemblies during etching, the yield can be improved and/or the cost of the etch tank and associated hardware can be reduced.

BACKGROUND OF THE INVENTION

Epitaxial lift off (ELO) is typically performed on device assemblies toseparate a substrate from a device by etching a release layer disposedbetween the substrate and the device. Conventional systems perform ELOby supplying an array of substrates and devices attached to a carrierfilm into an etch tank. Hydrofluoric acid (HF) is used to etch therelease layer to separate the substrates from the devices. After theetching is complete, the devices attached to the carrier film areremoved from the etch tank for further processing and to enable etchingof the next batch of devices and substrates.

Although conventional systems can be used to perform ELO, the number ofdevice assemblies that can be etched simultaneously using conventionalsystems is limited by the footprint or size of the etch tank. Thus, theyield of etched device assemblies using conventional systems isrelatively low.

Additionally, the cost of the etch tanks and associated hardware isproportional to the size of the etch tanks. Therefore, even if aconventional system were sized to supply an acceptable yield, the sizeand cost of that system would be prohibitively high.

SUMMARY OF THE INVENTION

Accordingly, a need exists to perform epitaxial lift off (ELO) withimproved yield. Additionally, a need exists to perform ELO with reducedcost. Embodiments of the present invention provide novel solutions tothese needs and others as described below.

Embodiments of the present invention are directed to an apparatus,system and method for performing ELO. More specifically, deviceassemblies are contemporaneously etched in a stacked arrangement. Eachdevice assembly may be placed in a respective tray, where the trays areoverlapped and spaced apart from one another. In this manner, moredevice assemblies can be etched per unit area compared to conventionalsystems. Further, by stacking device assemblies during etching, theyield can be improved and/or the cost of the etch tank and associatedhardware can be reduced.

In one embodiment, each device assembly may be clamped to a respectivetray using a respective first member. A respective second membercorresponding to each tray may be used to apply a bending load to thedevice assemblies during etching to separate the substrates from thedevice assemblies. Hydrofluoric acid (HF) may be applied to each deviceassembly (e.g., by submerging the device assembly in HF, by pooling theHF in each tray around a respective device assembly, by spraying orotherwise directing the HF toward a respective release layer of eachdevice assembly, etc.) to perform the etching, where the HF may beapplied to each device assembly and/or allowed to flow away from eachdevice assembly using a respective third member corresponding to eachtray. In one embodiment, components corresponding to each tray (e.g.,first members used to clamp the device assemblies to the racks, secondmembers used to apply a bending load to the device assemblies, thirdmembers used to apply HF to and/or allow the HF to flow away from thedevice assemblies during etching, etc.) may be moved contemporaneouslyusing a common component (e.g., a first component coupled with the firstmembers, a second component coupled with the second members, a thirdcomponent coupled with the third members, etc.), thereby reducing thenumber of components in the system, the failure rate of the system, thecost of the system, some combination thereof, etc.

In one embodiment, an apparatus includes a plurality of trays operableto accept a plurality of device assemblies, wherein each device assemblyof the plurality of device assemblies includes a respective device and arespective substrate, wherein the plurality of trays are physicallyspaced apart from one another in a stacked arrangement. A firstplurality of members is operable to clamp the plurality of deviceassemblies to the plurality of trays, and wherein the first plurality ofmembers is coupled with a first component operable to contemporaneouslymove the first plurality of members. A second plurality of members isoperable to apply a bending load to the plurality of device assemblies,wherein the second plurality of members is further operable to enableseparation of the respective device and the respective substrateresponsive to an etching of a respective release layer disposed betweenthe respective device and the respective substrate, and wherein thesecond plurality of members is coupled with a second component operableto contemporaneously move the second plurality of members.

In another embodiment, a system includes a tank and an apparatusdisposed at least partially within the tank, wherein the apparatusincludes a plurality of trays operable to accept a plurality of deviceassemblies, wherein each device assembly of the plurality of deviceassemblies includes a respective device and a respective substrate,wherein the plurality of trays are physically spaced apart from oneanother in a stacked arrangement. A first plurality of members of theapparatus is operable to clamp the plurality of device assemblies to theplurality of trays, and wherein the first plurality of members iscoupled with a first component. A second plurality of members of theapparatus is operable to apply a bending load to the plurality of deviceassemblies, wherein the second plurality of members is further operableto enable separation of the respective device and the respectivesubstrate responsive to an etching of a respective release layerdisposed between the respective device and the respective substrate, andwherein the second plurality of members is coupled with a secondcomponent. The system further includes a first actuator operable tointerface with the first component and contemporaneously move the firstplurality of members. A second actuator is operable to interface withthe second component and contemporaneously move the second plurality ofmembers.

In yet another embodiment, a method of performing epitaxial lift offincludes clamping, using a first plurality of members of an apparatus, aplurality of device assemblies to a plurality of trays of the apparatus,wherein each device assembly of the plurality of device assembliesincludes a respective device and a respective substrate, wherein theplurality of trays are physically spaced apart from one another in astacked arrangement, and wherein the first plurality of members iscoupled with a first component operable to contemporaneously move thefirst plurality of members. A bending load is applied, using a secondplurality of members of the apparatus, to the plurality of deviceassemblies, and wherein the second plurality of members is coupled witha second component operable to contemporaneously move the secondplurality of members. The method further includes etching a respectiverelease layer disposed between the respective device and the respectivesubstrate to separate the respective device and the respectivesubstrate.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example, and not by wayof limitation, in the figures of the accompanying drawings and in whichlike reference numerals refer to similar elements.

FIG. 1 shows a side view of an exemplary device assembly in accordancewith one embodiment of the present invention.

FIG. 2 shows a diagram of a bottom surface of a film in accordance withone embodiment of the present invention.

FIG. 3 shows an exemplary epitaxial lift off performed in accordancewith one embodiment of the present invention.

FIG. 4 shows an exemplary system for preparing device assemblies inaccordance with one embodiment of the present invention.

FIG. 5 shows an exemplary apparatus for performing epitaxial lift off inaccordance with one embodiment of the present invention.

FIG. 6 shows an exemplary apparatus with a member in a raised positionin accordance with one embodiment of the present invention.

FIG. 7 shows an exemplary apparatus with a member in a position enablingfluid to flow away from a device assembly in accordance with oneembodiment of the present invention.

FIG. 8 shows an exemplary apparatus for performing epitaxial lift off ona plurality of device assemblies in a stacked arrangement in accordancewith one embodiment of the present invention.

FIG. 9 shows an exemplary apparatus for performing epitaxial lift offwith multiple bending members in accordance with one embodiment of thepresent invention.

FIG. 10 shows an exemplary apparatus for performing epitaxial lift offon a plurality of device assemblies in a stacked arrangement usingmultiple bending members in accordance with one embodiment of thepresent invention.

FIG. 11 shows an exemplary system for performing epitaxial lift off on aplurality of device assemblies in accordance with one embodiment of thepresent invention.

FIG. 12 shows an exemplary system for performing epitaxial lift off on aplurality of device assemblies with at least one actuator in accordancewith one embodiment of the present invention.

FIG. 13 shows a flowchart of an exemplary process for performingepitaxial lift off in accordance with one embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

Reference will now be made in detail to embodiments of the presentinvention, examples of which are illustrated in the accompanyingdrawings. While the present invention will be discussed in conjunctionwith the following embodiments, it will be understood that they are notintended to limit the present invention to these embodiments alone. Onthe contrary, the present invention is intended to cover alternatives,modifications, and equivalents which may be included with the spirit andscope of the present invention as defined by the appended claims.Furthermore, in the following detailed description of the presentinvention, numerous specific details are set forth in order to provide athorough understanding of the present invention. However, embodiments ofthe present invention may be practiced without these specific details.In other instances, well-known methods, procedures, components, andcircuits have not been described in detail so as not to unnecessarilyobscure aspects of the present invention.

Embodiments of the Invention

Embodiments of the present invention can improve epitaxial lift off(ELO) by contemporaneously etching device assemblies in a stackedarrangement. For example, each device assembly (e.g., as shown in FIGS.1 and 2) may be placed in a respective tray of an apparatus, where thetrays are overlapped and spaced apart from one another (e.g., as shownin FIGS. 5-14). In this manner, more device assemblies can be etched perunit area compared to conventional systems. Further, by stacking deviceassemblies during etching, the yield can be improved and/or the cost ofthe etch tank and associated hardware can be reduced.

FIG. 1 shows a side view of exemplary device assembly 100 in accordancewith one embodiment of the present invention. As shown in FIG. 1,release layer 130 is disposed between substrate 110 and device 120. Atleast one layer 140 is disposed on device 120, and film 150 is coupledwith at least one metal layer 140 via adhesive layer 160. In thismanner, embodiments of the present invention may be used to performepitaxial lift off (ELO) on device assembly 100 to remove substrate 110from device sub-assembly 170 (e.g., by etching release layer 130 toseparate substrate 110 from device 120).

Device 120 may be any semiconductor device such as a solar cell, lightemitting diode (LED), etc. Device 120 may include a plurality of layers.As such, embodiments of the present invention may be used to perform ELOfor one or more types of devices.

As shown in FIG. 1, release layer 130 may be any material capable ofbeing etched (e.g., aluminum arsenide, etc.). In on embodiment,substrate 110 may be any material capable of adhering to release layer130 and/or capable of growing one or more layers (e.g., release layer130, device 120, etc.) epitaxially. For example, substrate 110 mayinclude gallium arsenide, germanium, etc.

As shown in FIG. 1, at least one layer 140 may perform one or morefunctions. For example, at least one layer 140 may provide mechanicalsupport for device 120, provide at least one electrical contact fordevice 120, provide optical reflection for device 120, etc. Accordingly,at least one layer 140 may be made from a metal in one embodiment.

In one embodiment, one or more layers of device assembly 100 may begrown on top of one another. For example, release layer 130 may be grownon substrate 110. As another example, one or more layers of device 120may be grown on release layer 130. And as yet another example, one ormore layers of at least one layer 140 may be grown on device 120.

As shown in FIG. 1, film 150 may be any material which is flexible orcapable of being bent (e.g., responsive to a bending load appliedthereto). For example, film 150 may be made of Polyethyleneterephthalate (PET), another type of plastic, a material other than apolymer, etc.

Film 150 may have top surface 152 and bottom surface 154, where bottomsurface 154 may be disposed on adhesive layer 160. In one embodiment,film 150 may overhang or be larger than (e.g., in one or moredimensions) at least one other layer of device assembly 100 (e.g., asshown in FIG. 2). And in one embodiment, adhesive layer 130 may overhangor be larger than (e.g., in one or more dimensions) at least one otherlayer of device assembly 100.

FIG. 2 shows a diagram of bottom surface 154 of film 150 in accordancewith one embodiment of the present invention. As shown in FIG. 2, bottomsurface 154 may be divided into regions 210 and 220. At least one otherlayer of device assembly 100 (e.g., substrate 110, release layer 130,device 120, at least one layer 140, adhesive layer 160, etc.) may attachto or be coupled with region 210. Region 220 of film 150 may extendbeyond the at least one other layer of device assembly 100. In thismanner, film 150 may be larger than at least one other layer of deviceassembly 100 in at least one dimension.

Although FIG. 1 depicts device assembly 100 with a particular number,size, and shape of layers, it should be appreciated that device assembly100 may include a different number, size and/or shape of layers in otherembodiments. Additionally, although FIG. 1 depicts device assembly 100with a particular arrangement or ordering of layers, it should beappreciated that device assembly 100 may include a different arrangementor ordering of layers in other embodiments. Further, although FIG. 2depicts bottom surface 154 with a particular size and shape of regions,it should be appreciated that bottom surface 154 may include a differentsize and/or shape of regions in other embodiments.

FIG. 3 shows an exemplary ELO performed in accordance with oneembodiment of the present invention. As shown in FIG. 3, device assembly100 may be loaded into tray 340. Member 310 may be brought into contactwith top surface 152 to clamp device assembly 100 in tray 340. Member320 and/or member 330 may be brought into contact with bottom surface154 of film 150 (e.g., within region 220), where a relative movementbetween member 310 and members 320 and 330 (e.g., as depicted by arrows315, 325 and 335) may apply a bending load to device assembly 100.Release layer 130 may be etched by fluid 350 until substrate 110 isseparated from device sub-assembly 170.

In one embodiment, the bending load imparted on device assembly 100(e.g., using members 310, 320 and 330) may accelerate or otherwiseassist in removing release layer 130 from device assembly 100 duringetching. For example, the gap between substrate 110 and device 120 maybe widened as a result of the bending load, thereby allowing fluid 350to more easily reach the remaining portion of release layer 130 andcontinue the etching thereof.

Additionally, the force (e.g., in the downward direction as indicated byarrow 315) exerted on device assembly 100 by member 130 may reduce thestress on portion 360 of release layer 130. As such, embodiments of thepresent invention can increase the amount of release layer 130 etched byfluid 350 before separation of substrate 110 and device sub-assembly170, thereby reducing damage (e.g., tearing, breaking, etc.) to device120 and/or at least one layer 140 which could otherwise result from aninadvertent separation or breaking of portion 360 (e.g., if member 310were not used to relieve stresses imparted on portion 360).

In one embodiment, members 320 and 330 may be integrated into a singlecomponent. For example, members 320 and 330 may be part of a hoop (e.g.,member 530 as shown in FIG. 5 and FIG. 6) or other structure used toapply a bending load to device assembly 100. At least a portion of thehoop may come into contact with at least a portion of region 220 aroundat least one other layer of device assembly 100 (e.g., substrate 110,release layer 130, device 120, at least one layer 140, adhesive layer160, etc.). As such, in one embodiment, members 320 and 330 may beconnected such that they move together.

Members 320 and 330 may be separate members and/or be capable of movingindependently of one another in one embodiment. For example, members 320and 330 may be separate members (e.g., member 931 of FIG. 9, member 932of FIG. 9, member 933 of FIG. 9, member 934 of FIG. 9, member 935 ofFIG. 9, member 936 of FIG. 9, member 937 of FIG. 9, member 938 of FIG.9, etc.) used to apply a bending load to device assembly 100. Eachmember may come into contact with a different portion of bottom surface154 of film 150 (e.g., within region 220) around at least one otherlayer of device assembly 100 (e.g., substrate 110, release layer 130,device 120, at least one layer 140, adhesive layer 160, etc.). In oneembodiment, members 320 and 330 may be moved at different rates, overdifferent distances, using different forces, some combination thereof,etc. In this manner, the movement of each member can be individuallycontrolled to vary the stresses in different portions of device assembly100, control the etch rate of different portions of release layer 130,etc.

As shown in FIG. 2, fluid 350 may be disposed on and/or directed towardrelease layer 130 to enable etching thereof. Fluid 350 may be pooledaround device 100, sprayed or otherwise directed toward release layer130, some combination thereof, etc. And in one embodiment, fluid 350 maybe hydrofluoric acid (HF).

Although FIG. 3 depicts device assembly 100 with a particular number,size, and shape of layers, it should be appreciated that device assembly100 may include a different number, size and/or shape of layers in otherembodiments. Additionally, although FIG. 3 depicts device assembly 100with a particular arrangement or ordering of layers, it should beappreciated that device assembly 100 may include a different arrangementor ordering of layers in other embodiments.

FIG. 4 shows exemplary system 400 for preparing device assemblies inaccordance with one embodiment of the present invention. As shown inFIG. 4, ELO system 410 may receive device assemblies with substrates(e.g., 100) and perform ELO to separate the substrates from the deviceassemblies. The separated device assemblies and substrates (e.g., 415)may be output from ELO system 410.

In one embodiment, ELO system 410 may include an apparatus (e.g., asdepicted in FIGS. 5-14) for contemporaneously etching a plurality ofdevice assemblies in a stacked arrangement. The apparatus may bedisposed at least partially within a tank (e.g., tank 1170 of FIG. 11).Additionally, ELO system 410 may include actuators for moving members ofthe apparatus. For example, a first actuator may contemporaneously movemembers which clamp the device assemblies to trays of the apparatus, asecond actuator may contemporaneously move members which apply bendingloads to the device assemblies, a third actuator may contemporaneouslymove components which apply fluid 350 to the device assemblies foretching and/or enable fluid 350 to flow away from the device assemblies,etc.

As shown in FIG. 4, processing system 420 may receive the separateddevice sub-assemblies (e.g., 170) and substrates (e.g., 110) and performone or more operations thereon. For example, processing system 420 mayclean the separated device sub-assemblies (e.g., 170) and/or substrates(e.g., 110), rinse the separated device sub-assemblies (e.g., 170)and/or substrates (e.g., 110), dry the separated device sub-assemblies(e.g., 170) and/or substrates (e.g., 110), perform another operation onthe separated device sub-assemblies (e.g., 170) and/or substrates (e.g.,110), some combination thereof, etc. As another example, processingsystem 420 may remove the substrates (e.g., 110) and/or the devicesub-assemblies (e.g., 170) from the trays of the apparatus. Once theprocessing has been completed, the substrates (e.g., 110) and devicesub-assemblies (e.g., 170) may be output for reuse (e.g., the substratesmay be used to produce other device assemblies and/or devicesub-assemblies), for further processing, for storage, etc.

In one embodiment, processing system 420 may receive the apparatus(e.g., 500 of FIG. 5, 800 of FIG. 8, 900 of FIG. 9, 1000 of FIG. 10,etc.) holding the separated device sub-assemblies (e.g., 170) andsubstrates (e.g., 110) from ELO system 410. For example, the one or moreoperations (e.g., cleaning, rinsing, drying, etc.) performed on thesubstrates (e.g., 110) and/or device sub-assemblies (e.g., 170) may beperformed while the substrates and/or device sub-assemblies remain inthe trays of the apparatus. As another example, the substrates (e.g.,110) may be removed from trays of the apparatus by a robot (e.g., with amechanism for grasping the substrates, with a vacuum pick-up systemcapable of holding the substrates, etc.), with compressed air (e.g.,capable of blowing the substrates out of the trays while leaving thedevice sub-assemblies in the trays), etc. In this manner, embodiments ofthe present invention can more efficiently transport or otherwiseprocess a plurality of device sub-assemblies and/or substrates from onestation to the next with fewer operations.

In one embodiment, the substrates (e.g., 110) and device sub-assemblies(e.g., 170) may be processed (e.g., cleaned, rinsed, dried, etc.) beforeremoving the substrates (e.g., 110) and/or device sub-assemblies (e.g.,170) from the trays of the apparatus. The substrates (e.g., 110) anddevice sub-assemblies (e.g., 170) may be processed (e.g., cleaned,rinsed, dried, etc.) after removing the substrates (e.g., 110) and/ordevice sub-assemblies (e.g., 170) from the trays of the apparatus in oneembodiment. And in one embodiment, the substrates (e.g., 110) and devicesub-assemblies (e.g., 170) may be processed (e.g., cleaned, rinsed,dried, etc.) both before and after removing the substrates (e.g., 110)and/or device sub-assemblies (e.g., 170) from the trays of theapparatus.

Although FIG. 4 depicts system 400 with a particular number of systems(e.g., 410 and 420), it should be appreciated that system 400 mayinclude a different number of systems in other embodiments.Additionally, although FIG. 4 depicts system 400 with a particulararrangement or ordering of systems, it should be appreciated that system400 may include a different arrangement or ordering of systems in otherembodiments.

FIG. 5 shows exemplary apparatus 500 for performing ELO in accordancewith one embodiment of the present invention. As shown in FIG. 5,apparatus 500 includes tray 510 for accepting a device assembly (e.g.,100). Member 520 may be lowered to clamp the device assembly (e.g., 110)to tray 510. A bending load may be applied to the device assembly byraising member 530 (e.g., which may contact region 220 of bottom surface154 of film 150). A release layer (e.g., 130) of the device assembly maybe etched to separate the substrate (e.g., 110) from the devicesub-assembly (e.g., 170). Thereafter, member 520 and/or 530 may beraised and the substrate (e.g., 110) and/or device sub-assembly (e.g.,170) may be removed from the apparatus. In one embodiment, the substrate(e.g., 110) and/or device sub-assembly (e.g., 170) may remain inapparatus for further processing (e.g., cleaning, rinsing, drying, somecombination thereof, etc.).

Components 550 a, 550 b and 550 c may extend through holes in tray 510.Tray 510 may rest on one or more components (e.g., 560 a, 560 b, etc.)which are clamped to or otherwise attached to components 550 a, 550 band 550 c. The components (e.g., 560 a, 560 b, etc.) may be used tocontrol the height of tray 510 and/or the spacing between tray 510 andat least one other tray. In this manner, multiple trays can beadvantageously placed in a stacked arrangement (e.g., on components 550a, 550 b and 550 c) for contemporaneously etching multiple deviceassemblies, thereby increasing the number of device assemblies that canbe etched per unit area, increasing the number of device assemblies thatcan be etched per unit time (e.g., resulting in an increased yield),reducing cost or capital expenditure, some combination thereof, etc.

As shown in FIG. 5, member 530 may be coupled with component 570 aand/or component 570 b. In one embodiment, one side of member 530 may besecured to component 580 a, where component 580 a may be clamped on orotherwise attached to component 570 a. And in one embodiment, the otherside of member 530 may be secured to component 580 b, where component580 b may be clamped on or otherwise attached to component 570 b.Accordingly, movement or articulation of at least one component (e.g.,570 a, 570 b, etc.) with respect to tray 510 may move member 530 withrespect to tray 510, thereby enabling member 530 to be movedcontemporaneously with other members (e.g., similar to member 530 andused to apply bending loads to other device assemblies disposed in othertrays) which are also coupled with the at least one component (e.g., 570a, 570 b, etc.).

FIG. 6 shows exemplary apparatus 500 with member 530 in a raisedposition in accordance with one embodiment of the present invention. Asshown in FIG. 6, member 530 may be raised (e.g., by moving orarticulating component 570 a and/or 570 b) to apply a bending load to adevice assembly (e.g., 100). Member 520 may include an offset portion(e.g., 525) to reduce interference between members 520 and 530 whenmember 530 is in a raised position. In one embodiment, offset portion525 may be formed by one or more bends in member 520.

Turning back to FIG. 5, member 520 may be coupled with component 590. Inone embodiment, member 520 may be secured to component 595, wherecomponent 595 may be clamped on or otherwise attached to member 590. Inthis manner, movement or articulation of a component (e.g., 590) withrespect to tray 510 may move member 520 with respect to tray 510,thereby enabling member 520 to be moved contemporaneously with othermembers (e.g., similar to member 520 and used to clamp other deviceassemblies to other trays) which are also coupled with the component(e.g., 590).

As shown in FIG. 5, member 530 may be advantageously shaped to increasethe surface area of member 530 in contact with film 150 (e.g., region220 of bottom surface 154). In one embodiment, member 530 may be hoopshaped. In this manner, embodiments of the present invention may reducelocalized stress on film 150 and/or enable more uniform etching of therelease layer (e.g., 130) of the device assembly (e.g., 100).

Member 540 may be used to apply fluid (e.g., 350) to the release layer(e.g., 130) of the device assembly (e.g., 100) when in a first position(e.g., as shown in FIGS. 5 and 6). For example, fluid may be pooledand/or contained in tray 510 by the sidewalls of tray 510 (e.g.,sidewalls 516, 517 and 518) and member 540 in the first position (e.g.,responsive to a submerging of the tray and/or apparatus in the fluid,responsive to a directing of the fluid toward or into the tray, etc.).Alternatively, member 540 may be used to enable fluid (e.g., 350) toflow away from the release layer (e.g., 130) of the device assembly(e.g., 100) when in a second position (e.g., as shown in FIG. 7). Inthis manner, member 540 may be placed in the first position duringetching and placed in the second position after etching.

Member 540 may be rotatably coupled to tray 510 in one embodiment.Member 540 may be automatically moved between the first and secondpositions using feature 545 in one embodiment. For example, a component(e.g., moved by an actuator, robot, etc.) may interface with feature 545to rotate member 540 between positions. In one embodiment, the componentthat interfaces with feature 545 may also interface with similarfeatures on other members (e.g., similar to member 540 and used to poolfluid around other device assemblies and/or enable fluid to flow awayfrom other device assemblies). And in one embodiment, member 540 may beplaced in the second position (e.g., as shown in FIG. 7) to enableremoval of the substrate (e.g., 110) and/or device sub-assembly (e.g.,170) after separation.

In one embodiment, tray 510 may include components (e.g., hoses,features for redirecting a flow of fluid, etc.) for spraying orotherwise directing the fluid (e.g., 350) toward the release layer(e.g., 130) of the device assembly (e.g., 100). And in one embodiment,tray 510 may also include clamps or other features for holding orsecuring hoses or other components used to spray or otherwise direct thefluid (e.g., 350) toward the release layer (e.g., 130) of the deviceassembly (e.g., 100).

Although FIGS. 5, 6 and 7 show apparatus 500 with a specific number ofcomponents, it should be appreciated that apparatus 500 may include adifferent number of components in other embodiments. For example,apparatus 500 may include multiple members similar to (e.g., in shape,size, function, some combination thereof, etc.) member 520, multiplemembers similar to (e.g., in shape, size, function, some combinationthereof, etc.) member 530, multiple members similar to (e.g., in shape,size, function, some combination thereof, etc.) member 540, somecombination thereof, etc. Additionally, although FIGS. 5, 6 and 7 showapparatus 500 with a specific size and shape of components, it should beappreciated that apparatus 500 may include a different size and/or shapeof components in other embodiments. Further, although FIGS. 5, 6 and 7show apparatus 500 with a specific configuration of components, itshould be appreciated that apparatus 500 may include a differentconfiguration of components in other embodiments. For example, tray 510may be capable of holding and/or etching more than one device assembly(e.g., similar to device assembly 100).

FIG. 8 shows exemplary apparatus 800 for performing ELO on a pluralityof device assemblies in a stacked arrangement in accordance with oneembodiment of the present invention. As shown in FIG. 8, apparatus 800includes assembly 810, assembly 820 and assembly 830, where each of theassemblies includes a respective first member (e.g., 812, 822, and 832,respectively) for clamping a respective device assembly (e.g., 100) to arespective tray (e.g., 811, 821, and 831, respectively), a respectivesecond member (e.g., 813, 823, and 833, respectively) for applying abending load to a respective device assembly (e.g., 100), and arespective third member (e.g., 814, 824, and 834, respectively) forapplying fluid to and/or directing fluid away from a respective deviceassembly (e.g., 100) for etching a respective release layer (e.g., 130)to separate a respective substrate (e.g., 110) from a respective devicesub-assembly (e.g., 170). In one embodiment, one or more of theassemblies of apparatus 800 (e.g., assembly 810, assembly 820, assembly830, etc.) may be implemented in accordance with apparatus 500. In thismanner, a plurality of device assemblies can be contemporaneously etchedin stacked arrangement to increase the number of device assemblies thatcan be etched per unit area, increase the number of device assembliesthat can be etched per unit time (e.g., resulting in an increasedyield), reduce cost or capital expenditure, some combination thereof,etc.

As shown in FIG. 8, respective members of each assembly may be coupledwith a common component to enable contemporaneous movement of therespective members by articulating the component (e.g., instead ofindividually moving each respective member using a separate component).For example, members 812, 822 and 832 may be coupled with component 590,and therefore, component 590 may be articulated (e.g., moved upward withrespect to at least one other component of apparatus 800, moved downwardwith respect to at least one other component of apparatus 800, etc.) tocontemporaneously move members 812, 822 and 832. As another example,members 813, 823 and 833 may be coupled with components 570 a and 570 b,and therefore, components 570 a and 570 b may be articulated (e.g.,moved upward with respect to at least one other component of apparatus800, moved downward with respect to at least one other component ofapparatus 800, etc.) to contemporaneously move members 813, 823 and 833.As yet another example, members 814, 824 and 834 may interface with acommon component (not shown) which is capable of contemporaneouslymoving members 814, 824 and 834 (e.g., between a first position and asecond position). Accordingly, embodiments of the present invention canperform ELO on a plurality of device assemblies with a reduced number ofcomponents, thereby reducing the failure rate of the system, the cost ofthe system, some combination thereof, etc.

In one embodiment, each of the components (e.g., 570 a, 570 b, 590,etc.) used to move the members (e.g., 812, 822, 832, 813, 823, 833, 814,824, 834, etc.) may be coupled with a respective component foroffsetting or otherwise changing the point of articulation. For example,component 570 a may be coupled with component 870 a, and component 570 bmay be coupled with component 870 b. As such, articulation of component870 a and/or component 870 b may contemporaneously move members 813, 823and 833.

In one embodiment, a plurality of components of apparatus 800 may bemade from the same material or different materials with the similar (orthe same) coefficients of thermal expansion. For example, components(e.g., 550 a, 550 b, 550 c, etc.) used to space and/or support the trays(e.g., 811, 821, 831, etc.) may be made from the same material ordifferent materials with the similar (or the same) coefficients ofthermal expansion as at least one component (e.g., 590, etc.) used tomove clamping members (e.g., 812, 822, 832, etc.), at least onecomponent (e.g., 570 a, 570 b, etc.) used to move bending members (e.g.,813, 823, 833, etc.), at least one component used to move anotherrespective member of each assembly (e.g., 810, 820, 830, etc.), somecombination thereof, etc. In this manner, the height or positioning of arespective member (e.g., 812, 822, 832, 813, 823, 833, 814, 824, 834,etc.) with respect to each tray (e.g., 811, 821, 831, etc.) may besubstantially maintained regardless of thermal expansion (e.g., due toheating of apparatus 800) and/or thermal contraction (e.g., due tocooling of apparatus 800).

Although FIG. 8 shows apparatus 800 with a specific number ofcomponents, it should be appreciated that apparatus 800 may include adifferent number of components in other embodiments. For example,apparatus 800 may include a different number of assemblies in otherembodiments. As another example, each assembly of apparatus 800 (e.g.,assembly 810, assembly 820, assembly 830, etc.) may include multipleclamping members (e.g., 812, 822, 832, etc.), multiple bending members(e.g., 813, 823, 833, etc.), multiple members used to direct fluidtoward and/or away from a respective device assembly (e.g., 814, 824,834, etc.), some combination thereof, etc. Additionally, although FIG. 8shows apparatus 800 with a specific size and shape of components, itshould be appreciated that apparatus 800 may include a different sizeand/or shape of components in other embodiments. Further, although FIG.8 shows apparatus 800 with a specific configuration of components, itshould be appreciated that apparatus 800 may include a differentconfiguration of components in other embodiments. For example, apparatus800 may include at least one tray (e.g., similar to tray 811, tray 821,tray 831, etc.) capable of holding and/or etching more than one deviceassembly (e.g., similar to device assembly 100).

FIG. 9 shows exemplary apparatus 900 for performing ELO with multiplebending members in accordance with one embodiment of the presentinvention. As shown in FIG. 9, apparatus 900 includes multiple members(e.g., 931, 932, 933, 934, 935, 936, 937, 938, etc.) which are separateand/or capable of being moved independently of one another, where eachof the members may be used to apply a bending load to a device assembly(e.g., 100). For example, where a device assembly (e.g., 100) is clampedto tray 510 (e.g., by member 520), each member may be moved upward tocontact a different portion of bottom surface 154 of film 150 (e.g.,within region 220) and apply a bending load thereto. The at least onebending load applied using one or more of the members (e.g., 931, 932,933, 934, 935, 936, 937, 938, etc.) may be used to separate a substrate(e.g., 110) from a device sub-assembly (e.g., 170) via etching a releaselayer (e.g., 130) of the device assembly (e.g., 100). In one embodiment,each of the bending members (e.g., 931-938) may be moved at a differentrate, over a different distance, using different forces, somecombination thereof, etc. In this manner, the movement of each membercan be individually controlled to vary the stresses in differentportions of the device assembly (e.g., 100), control the etch rate ofdifferent portions of the release layer (e.g., 130), etc.

As shown in FIG. 9, each member (e.g., 931, 932, 933, 934, 935, 936,937, 938, etc.) may be coupled with a separate or different component.For example, member 931 may be coupled with component 941, member 932may be coupled with component 942, member 933 may be coupled withcomponent 943, member 934 may be coupled with component 944, member 935may be coupled with component 945, member 936 may be coupled withcomponent 946, member 937 may be coupled with component 947, and member938 may be coupled with component 948. Accordingly, movement orarticulation of a component (e.g., 941, 942, 943, 944, 945, 946, 947,948, etc.) with respect to tray 510 may move a member (e.g., 931, 932,933, 934, 935, 936, 937, 938, etc.) with respect to tray 510, therebyenabling each member to be moved independently of at least one othermember (e.g., members 931 and 935 are raised, whereas the other membersare lowered).

In one embodiment, each member (e.g., 931, 932, 933, 934, 935, 936, 937,and 938) may be coupled with a respective component (e.g., 941, 942,943, 944, 945, 946, 947, 948, respectively) via at least one otherrespective component (e.g., 951, 952, 953, 954, 955, 956, 957, 958,respectively). Each of the members may be secured to one of the otherrespective components (e.g., via at least one screw or some otherattachment mechanism), where each of the other respective components(e.g., 951, 952, 953, 954, 955, 956, 957, 958, etc.) is clamped on orotherwise attached to a respective component (e.g., 941, 942, 943, 944,945, 946, 947, 948, etc.).

Although FIG. 9 shows apparatus 900 with a specific number ofcomponents, it should be appreciated that apparatus 900 may include adifferent number of components in other embodiments. For example,apparatus 900 may include multiple members similar to (e.g., in shape,size, function, some combination thereof, etc.) member 520, a differentnumber of members similar to (e.g., in shape, size, function, somecombination thereof, etc.) a bending member (e.g., 931, 932, 933, 934,935, 936, 937, 938, etc.), multiple members similar to (e.g., in shape,size, function, some combination thereof, etc.) member 540, somecombination thereof, etc. Additionally, although FIG. 9 shows apparatus900 with a specific size and shape of components, it should beappreciated that apparatus 900 may include a different size and/or shapeof components in other embodiments. Further, although FIG. 9 showsapparatus 900 with a specific configuration of components, it should beappreciated that apparatus 900 may include a different configuration ofcomponents in other embodiments. For example, tray 510 may be capable ofholding and/or etching more than one device assembly (e.g., similar todevice assembly 100).

FIG. 10 shows exemplary apparatus 1000 for performing ELO on a pluralityof device assemblies in a stacked arrangement using multiple bendingmembers in accordance with one embodiment of the present invention. Asshown in FIG. 10, apparatus 1000 includes assembly 1010, assembly 1020and assembly 1030, where each of the assemblies includes a respectivefirst member (e.g., 812, 822, and 832, respectively) for clamping arespective device assembly (e.g., 100) to a respective tray (e.g., 811,821, and 831, respectively), a respective plurality of second members(e.g., similar to members 931-938) for applying at least one bendingload to a respective device assembly (e.g., 100), and a respective thirdmember (e.g., 814, 824, and 834, respectively) for applying fluid toand/or directing fluid away from a respective device assembly (e.g.,100) for etching a respective release layer (e.g., 130) to separate arespective substrate (e.g., 110) from a respective device sub-assembly(e.g., 170). In one embodiment, one or more of the assemblies ofapparatus 1000 (e.g., assembly 1010, assembly 1020, assembly 1030, etc.)may be implemented in accordance with apparatus 900. In this manner, aplurality of device assemblies can be contemporaneously etched instacked arrangement to increase the number of device assemblies that canbe etched per unit area, increase the number of device assemblies thatcan be etched per unit time (e.g., resulting in an increased yield),reduce cost or capital expenditure, some combination thereof, etc.

As shown in FIG. 10, respective members of each assembly may be coupledwith a common component to enable contemporaneous movement of therespective members by articulating the component (e.g., instead ofindividually moving each respective member using a separate component).For example, members 812, 822 and 832 may be coupled with component 590,and therefore, component 590 may be articulated (e.g., moved upward withrespect to at least one other component of apparatus 1000, moveddownward with respect to at least one other component of apparatus 1000,etc.) to contemporaneously move members 812, 822 and 832. As anotherexample, each bending member (e.g., similar to members 931-938) of eachassembly (e.g., 1010, 1020, 1030, etc.) may be coupled with a respectivecomponent (e.g., 941, 942, 943, 944, 945, 946, 947, 948, respectively),and therefore, each component (e.g., 941, 942, 943, 944, 945, 946, 947,948, etc.) may be articulated (e.g., moved upward with respect to atleast one other component of apparatus 1000, moved downward with respectto at least one other component of apparatus 1000, etc.) tocontemporaneously move a respective plurality of members (e.g., membersof each assembly similar to member 931, members of each assembly similarto member 932, members of each assembly similar to member 933, etc.)coupled therewith. As yet another example, members 814, 824 and 834 mayinterface with a common component (not shown) which is capable ofcontemporaneously moving members 814, 824 and 834 (e.g., between a firstposition and a second position). Accordingly, embodiments of the presentinvention can perform ELO on a plurality of device assemblies with areduced number of components, thereby reducing the failure rate of thesystem, the cost of the system, some combination thereof, etc.

In one embodiment, each of the components (e.g., 941, 942, 943, 944,945, 946, 947, 948, etc.) used to move the members (e.g., bendingmembers of each assembly similar to 931-938, 812, 822, 832, 814, 824,834, etc.) may be coupled with a respective component for offsetting orotherwise changing the point of articulation. For example, component 941may be coupled with component 1051, component 942 may be coupled withcomponent 1052, component 943 may be coupled with component 1053,component 944 may be coupled with component 1054, component 945 may becoupled with component 1055, component 946 may be coupled with component1056, component 947 may be coupled with component 1057, component 948may be coupled with component 1058, etc. As such, articulation of eachcomponent (e.g., 1051, 1052, 1053, 1054, 1055, 1056, 1057, 1058, etc.)may contemporaneously move a respective plurality of members (e.g.,members of each assembly similar to member 931, members of each assemblysimilar to member 932, members of each assembly similar to member 933,etc.) coupled therewith.

In one embodiment, a plurality of components of apparatus 1000 may bemade from the same material or different materials with the similar (orthe same) coefficients of thermal expansion. For example, components(e.g., 550 a, 550 b, 550 c, etc.) used to space and/or support the trays(e.g., 811, 821, 831, etc.) may be made from the same material ordifferent materials with the similar (or the same) coefficients ofthermal expansion as at least one component (e.g., 590, etc.) used tomove clamping members (e.g., 812, 822, 832, etc.), at least onecomponent (e.g., 1051, 1052, 1053, 1054, 1055, 1056, 1057, 1058, etc.)used to move bending members (e.g., members of each assembly similar tomember 931, members of each assembly similar to member 932, members ofeach assembly similar to member 933, etc.), at least one component usedto move another respective member of each assembly (e.g., 1010, 1020,1030, etc.), some combination thereof, etc. In this manner, the heightor positioning of a respective member (e.g., bending members of eachassembly similar to 931-938, 812, 822, 832, 814, 824, 834, etc.) withrespect to each tray (e.g., 811, 821, 831, etc.) may be substantiallymaintained regardless of thermal expansion (e.g., due to heating ofapparatus 1000) and/or thermal contraction (e.g., due to cooling ofapparatus 1000).

Although FIG. 10 shows apparatus 1000 with a specific number ofcomponents, it should be appreciated that apparatus 1000 may include adifferent number of components in other embodiments. For example,apparatus 1000 may include a different number of assemblies in otherembodiments. As another example, each assembly of apparatus 1000 (e.g.,assembly 1010, assembly 1020, assembly 1030, etc.) may include multipleclamping members (e.g., 812, 822, 832, etc.), a different number ofbending members (e.g., similar to members 931-938), multiple membersused to direct fluid toward and/or away from a respective deviceassembly (e.g., 814, 824, 834, etc.), some combination thereof, etc.Additionally, although FIG. 10 shows apparatus 1000 with a specific sizeand shape of components, it should be appreciated that apparatus 1000may include a different size and/or shape of components in otherembodiments. Further, although FIG. 10 shows apparatus 1000 with aspecific configuration of components, it should be appreciated thatapparatus 1000 may include a different configuration of components inother embodiments. For example, apparatus 1000 may include at least onetray (e.g., similar to tray 811, tray 821, tray 831, etc.) capable ofholding and/or etching more than one device assembly (e.g., similar todevice assembly 100).

FIG. 11 shows exemplary system 1100 for performing ELO on a plurality ofdevice assemblies in accordance with one embodiment of the presentinvention. As shown in FIG. 11, system 1100 includes a plurality ofapparatuses (e.g., 1110, 1120, 1130, 1140, 1150 and 1160), where eachapparatus may enable a plurality of device assemblies (e.g., similar todevice assembly 100) to be contemporaneously etched in stackedarrangement. In one embodiment, each apparatus may be implemented inaccordance with apparatus 500, apparatus 800, apparatus 900, apparatus1000, some combination thereof, etc. And in one embodiment, system 1100may be used to implement ELO system 410, processing system 420, somecombination thereof, etc.

As shown in FIG. 11, each of the apparatuses (e.g., 1110, 1120, 1130,1140, 1150 and 1160) may be positioned with respect to tank 1170 suchthat fluid (e.g., HF, another fluid, etc.) used to etch the deviceassemblies may be directed by tank 1170, contained within tank 1170,etc. In one embodiment, each of the apparatuses (e.g., 1110, 1120, 1130,1140, 1150 and 1160) may be disposed at least partially within tank1170, thereby enabling the fluid to be applied to the one or more deviceassemblies (e.g., by submerging the apparatus within fluid in tank 1170,by spraying or otherwise directing fluid to the one or more deviceassemblies held by the apparatus, etc.). And in one embodiment, tank1170 may be made from a material resistant to HF or another fluid usedto etch release layers (e.g., similar to release layer 130) of thedevice assemblies (e.g., similar to device assembly 100).

In one embodiment, at least one member and/or at least one component ofone apparatus of system 1100 may be coupled with at least one memberand/or at least one component of at least one other apparatus of system1100. For example, at least one clamping member (e.g., similar to one ormore of members 812, 822, 832, etc.) of apparatus 1110 may be coupled toat least one clamping member (e.g., similar to one or more of members812, 822, 832, etc.) of at least one other apparatus (e.g., 1120, 1130,1140, 1150 and 1160, etc.). As another example, at least one bendingmember (e.g., similar to one or more of members 813, 823, 833, 931-938,etc.) of apparatus 1110 may be coupled to at least one bending member(e.g., similar to one or more of members 813, 823, 833, 931-938, etc.)of at least one other apparatus (e.g., 1120, 1130, 1140, 1150 and 1160,etc.). As yet another example, at least one member used to direct fluidtoward and/or away from a respective device assembly (e.g., similar toone or more of members 814, 824, 834, etc.) of apparatus 1110 may becoupled to at least one member used to direct fluid toward and/or awayfrom a respective device assembly (e.g., similar to one or more ofmembers 814, 824, 834, etc.) of at least one other apparatus (e.g.,1120, 1130, 1140, 1150 and 1160, etc.). In this manner, at least onerespective member and/or at least one respective component of each of aplurality of apparatuses (e.g., 1110, 1120, 1130, 1140, 1150 and 1160,etc.) may be contemporaneously moved or articulated using a commonactuator.

Accordingly, system 1100 can increase the number of device assembliesthat can be etched per unit area (e.g., thereby reducing the size orfootprint of tank 1170 for a given yield compared to conventionalsystems), increase the number of device assemblies that can be etchedper unit time (e.g., resulting in an increased yield), reduce cost orcapital expenditure, some combination thereof, etc. Additionally,embodiments of the present invention can perform ELO on a plurality ofdevice assemblies with a reduced number of components, thereby reducingthe failure rate of the system, the cost of the system, some combinationthereof, etc.

Although FIG. 11 shows system 1100 with a specific number of components,it should be appreciated that system 1100 may include a different numberof components in other embodiments. For example, system 1100 may includea different number of apparatuses, etc. Additionally, although FIG. 11shows system 1100 with a specific size and shape of components, itshould be appreciated that system 1100 may include a different sizeand/or shape of components in other embodiments.

FIG. 12 shows exemplary system 1200 for performing ELO on a plurality ofdevice assemblies with at least one actuator in accordance with oneembodiment of the present invention. As shown in FIG. 12, system 1200includes a plurality of actuators (e.g., 1210, 1220, 1230, 1240, 1250,1260, etc.), where each actuator may articulate or move a respectivemember and/or a respective component of each apparatus (e.g., 1110,1120, 1130, etc.), of each assembly of each apparatus, etc. For example,actuator 1210 may move or articulate at least one clamping member ofeach apparatus, actuator 1220 may move or articulate at least onebending member of each apparatus, actuator 1230 may move or articulateat least one member of each apparatus used to for apply fluid to and/ordirect fluid away from a respective device assembly, etc.

Each actuator may be coupled with at least one member and/or at leastone component via at a respective component. For example, actuator 1220may be coupled with at least one member and/or at least one componentvia component 1225, actuator 1230 may be coupled with at least onemember and/or at least one component via component 1235, actuator 1250may be coupled with at least one member and/or at least one componentvia component 1255, actuator 1260 may be coupled with at least onemember and/or at least one component via component 1265, etc. In oneembodiment, the components (e.g., 1225, 1235, 1255, 1265, etc.) may berouted or otherwise be disposed between tank 1170 and at least oneapparatus (e.g., 1110, 1120, 1130, etc.).

As shown in FIG. 12, the actuators (e.g., 1210, 1220, 1230, 1240, 1250,1260, etc.) may be coupled with one or more support members (e.g., 1270and 1280). The support members (e.g., 1270 and 1280) may span tank 1170in one embodiment.

In one embodiment, one or more of the actuators (e.g., 1210, 1220, 1230,1240, 1250, 1260, etc.) may be pneumatic actuators and/or hydraulicactuators. In one embodiment, one or more of the actuators (e.g., 1210,1220, 1230, 1240, 1250, 1260, etc.) may be stepper motor actuators. Andin one embodiment, one or more of the actuators (e.g., 1210, 1220, 1230,1240, 1250, 1260, etc.) may be another type of actuator.

In one embodiment, system 1200 may be used to implement one or morecomponents of system 400. For example, system 1200 may be used toimplement ELO system 410, substrate removal system 420, some combinationthereof, etc.

Although FIG. 12 shows system 1200 with a specific number of components,it should be appreciated that system 1200 may include a different numberof components in other embodiments. For example, system 1200 may includea different number of apparatuses, a different number of actuators, etc.Additionally, although FIG. 12 shows system 1200 with a specific sizeand shape of components, it should be appreciated that system 1200 mayinclude a different size and/or shape of components in otherembodiments.

FIG. 13 shows a flowchart of exemplary process 1300 for performing ELOin accordance with one embodiment of the present invention. As shown inFIG. 13, step 1310 involves loading a plurality of device assemblies(e.g., 100) into a plurality of trays (e.g., 510, 811, 821, 831, etc.)of an apparatus (e.g., 500, 800, 900, 1000, etc.). In one embodiment, atleast one clamping member (e.g., 520, 812, 822, 832, etc.) may be in araised position during loading of the device assemblies in step 1310. Inone embodiment, at least one bending member (e.g., 530, 813, 823, 833,931-938, etc.) may be in a lowered position during loading of the deviceassemblies in step 1310. And in one embodiment, step 1310 may beperformed by a robot (e.g., with a mechanism for grasping thesubstrates, with a vacuum pick-up system capable of holding thesubstrates, etc.).

Step 1320 involves clamping the plurality of device assemblies (e.g.,loaded in step 1310) to the plurality of trays of the apparatus. Step1320 may involve lowering at least one clamping member (e.g., 520, 812,822, 832, etc.) to clamp the plurality of device assemblies (e.g.,loaded in step 1310) to the plurality of trays (e.g., 510, 811, 821,831, etc.). The at least one clamping member may be contemporaneouslymoved in step 1320 by actuating (e.g., using an actuator such asactuator 1210, actuator 1220, actuator 1230, actuator 1240, actuator1250, actuator 1260, etc.) a component (e.g., 590) coupled with the atleast one clamping member.

As shown in FIG. 13, step 1330 involves applying a bending load to theplurality of device assemblies (e.g., loaded in step 1310). Step 1330may involve raising at least one bending member (e.g., 530, 813, 823,833, 931-938, etc.) to contact a respective film (e.g., similar to film150) of each of the plurality of device assemblies and apply at leastone respective bending load to each of the plurality of deviceassemblies. The at least one bending member may be contemporaneouslymoved in step 1330 by actuating (e.g., using an actuator such asactuator 1210, actuator 1220, actuator 1230, actuator 1240, actuator1250, actuator 1260, etc.) a component (e.g., 570 a, 570 b, 941-948,etc.) coupled with the at least one bending member.

Step 1340 involves etching a plurality of release layers (e.g., similarto release layer 130) to separate a plurality of substrates (e.g.,similar to substrate 110) from the plurality of device sub-assemblies(e.g., similar to device sub-assembly 170). In one embodiment, step 1340may involve positioning a plurality of members (e.g., 540, 814, 824,834, etc.) in a first position to enable fluid (e.g., such as HF, etc.)to pool or collect around the plurality of device assemblies (e.g.,similar to device assembly 100), thereby enabling the release layers tobe etched. In one embodiment, step 1340 may involve submerging at leastone tray of an apparatus in a fluid (e.g., such as HF, etc.) to enableetching of a respective release layer (e.g., 130) of at least one deviceassembly (e.g., 100). And in one embodiment, step 1340 may involvespraying or otherwise directing a fluid (e.g., such as HF, etc.) towardthe one or more device assemblies (e.g., 100) to enable etching of arespective release layer (e.g., 130). After etching, the plurality ofmembers (e.g., 540, 814, 824, 834, etc.) may be positioned in a secondposition to enable the fluid to flow away from the plurality of deviceassemblies (e.g., into tank 1170).

In one embodiment, one or more of steps 1310 through 1340 may beperformed using ELO system 410. And in one embodiment, one or more ofsteps 1310 through 1340 may be performed using system 1100 and/or system1200.

As shown in FIG. 13, step 1350 involves processing the plurality ofsubstrates (e.g., 110, similar to substrate 110, etc.) and/or theplurality of device assemblies (e.g., similar to device sub-assembly170). For example, step 1350 may involve cleaning the devicesub-assemblies (e.g., 170) and/or substrates (e.g., 110), rinsing thedevice sub-assemblies (e.g., 170) and/or substrates (e.g., 110), dryingthe device sub-assemblies (e.g., 170) and/or substrates (e.g., 110),performing another operation on the device sub-assemblies (e.g., 170)and/or substrates (e.g., 110), some combination thereof, etc. As anotherexample, step 1350 may involve removing the substrates (e.g., 110)and/or the device sub-assemblies (e.g., 170) from the trays of theapparatus. And as yet another example, step 1350 may involve outputtingthe device sub-assemblies (e.g., 170) and/or substrates (e.g., 110) forreuse (e.g., the substrates may be used to produce other deviceassemblies and/or device sub-assemblies), for further processing, forstorage, etc. In one embodiment, step 1350 may be performed usingprocessing system 420.

In one embodiment, step 1350 may involve performing one or moreoperations (e.g., cleaning, rinsing, drying, etc.) on the substrates(e.g., 110) and/or device sub-assemblies (e.g., 170) while thesubstrates and/or device sub-assemblies remain in the trays of theapparatus. And in one embodiment, the substrates (e.g., 110) and devicesub-assemblies (e.g., 170) may be processed (e.g., cleaned, rinsed,dried, etc.) in step 1350 before and/or after removing the substrates(e.g., 110) and/or device sub-assemblies (e.g., 170) from the trays ofthe apparatus.

In the foregoing specification, embodiments of the invention have beendescribed with reference to numerous specific details that may vary fromimplementation to implementation. Thus, the sole and exclusive indicatorof what is, and is intended by the applicant to be, the invention is theset of claims that issue from this application, in the specific form inwhich such claims issue, including any subsequent correction. Hence, nolimitation, element, property, feature, advantage, or attribute that isnot expressly recited in a claim should limit the scope of such claim inany way. Accordingly, the specification and drawings are to be regardedin an illustrative rather than a restrictive sense.

1. An apparatus comprising: a plurality of trays operable to accept aplurality of device assemblies, wherein each device assembly of saidplurality of device assemblies comprises a respective device and arespective substrate, wherein said plurality of trays are physicallyspaced apart from one another in a stacked arrangement; a firstplurality of members operable to clamp said plurality of deviceassemblies to said plurality of trays, and wherein said first pluralityof members is coupled with a first component operable tocontemporaneously move said first plurality of members; and a secondplurality of members operable to apply a bending load to said pluralityof device assemblies, wherein said second plurality of members isfurther operable to enable separation of said respective device and saidrespective substrate responsive to an etching of a respective releaselayer disposed between said respective device and said respectivesubstrate, and wherein said second plurality of members is coupled witha second component operable to contemporaneously move said secondplurality of members.
 2. The apparatus of claim 1, wherein saidplurality of device assemblies each comprise a respective deviceselected from a group consisting of a solar cell and a light emittingdiode.
 3. The apparatus of claim 1, wherein said plurality of deviceassemblies further comprises a plurality of plastic films, wherein saidfirst plurality of members is operable to interface with a respectivefirst side of each of said plurality of plastic films, and wherein saidsecond plurality of members is operable to interface with a respectivesecond side of each of said plurality of plastic films.
 4. The apparatusof claim 1, wherein each of said second plurality of members is hoopshaped.
 5. The apparatus of claim 1 further comprising: a thirdplurality of members operable to apply a bending load to said pluralityof device assemblies, wherein said third plurality of members is furtheroperable to enable separation of said respective device and saidrespective substrate responsive to an etching of a respective releaselayer disposed between said respective device and said respectivesubstrate, wherein said third plurality of members is coupled with athird component operable to contemporaneously move said third pluralityof members, and wherein said second and third plurality of members areoperable to move independently of one another.
 6. The apparatus of claim1, wherein said plurality of trays comprises a plurality of componentsoperable to be placed in first position and a second position, whereinsaid plurality of components in said first position is operable toenable a fluid to be applied to said plurality of device assemblies forperforming said etching, and wherein said plurality of components insaid second position is operable to enable said fluid to flow away fromsaid plurality of device assemblies.
 7. A system comprising: a tank; anapparatus disposed at least partially within said tank, wherein saidapparatus comprises: a plurality of trays operable to accept a pluralityof device assemblies, wherein each device assembly of said plurality ofdevice assemblies comprises a respective device and a respectivesubstrate, wherein said plurality of trays are physically spaced apartfrom one another in a stacked arrangement; a first plurality of membersoperable to clamp said plurality of device assemblies to said pluralityof trays, and wherein said first plurality of members is coupled with afirst component; and a second plurality of members operable to apply abending load to said plurality of device assemblies, wherein said secondplurality of members is further operable to enable separation of saidrespective device and said respective substrate responsive to an etchingof a respective release layer disposed between said respective deviceand said respective substrate, and wherein said second plurality ofmembers is coupled with a second component; and a first actuatoroperable to interface with said first component and contemporaneouslymove said first plurality of members; and a second actuator operable tointerface with said second component and contemporaneously move saidsecond plurality of members.
 8. The system of claim 7, wherein saidplurality of device assemblies each comprise a respective deviceselected from a group consisting of a solar cell and a light emittingdiode.
 9. The system of claim 7, wherein said plurality of deviceassemblies further comprises a plurality of plastic films, wherein saidfirst plurality of members is operable to interface with a respectivefirst side of each of said plurality of plastic films, and wherein saidsecond plurality of members is operable to interface with a respectivesecond side of each of said plurality of plastic films.
 10. The systemof claim 7, wherein each of said second plurality of members is hoopshaped.
 11. The system of claim 7 further comprising: a third pluralityof members operable to apply a bending load to said plurality of deviceassemblies, wherein said third plurality of members is further operableto enable separation of said respective device and said respectivesubstrate responsive to an etching of a respective release layerdisposed between said respective device and said respective substrate,wherein said third plurality of members is coupled with a thirdcomponent operable to contemporaneously move said third plurality ofmembers, and wherein said second and third plurality of members areoperable to move independently of one another.
 12. The system of claim11 further comprising: a third actuator operable to interface with saidthird component and contemporaneously move said third plurality ofmembers.
 13. The system of claim 7, wherein said plurality of trayscomprises a plurality of components operable to be placed in firstposition and a second position, wherein said plurality of components insaid first position is operable to enable a fluid to be applied to saidplurality of device assemblies for performing said etching, and whereinsaid plurality of components in said second position is operable toenable said fluid to flow away from said plurality of device assemblies.14. The system of claim 14 further comprising: a fourth actuatoroperable to contemporaneously move said plurality of components. 15-23.(canceled)